光學元件

特崴光波導為了達成從模組設計到製造的垂直整合,不僅在生產流程中建立了完善的品質管控機制,以確保光電模組在批量化生產時仍能維持高穩定性與一致性,同時亦投入資源進行主要光學元件的自製化,以掌握核心技術並提升整體競爭力。

特崴光波導(QuantumZ)已成功開發並驗證「MM 980nm 25Gbps VCSEL 與 PD」光學元件。該產品採用多模(MM)架構設計,支援 COB 與 Flip-Chip 封裝方式,具備高性能、高可靠性與廣泛相容性。其光學特性穩定,功耗低、傳輸速度快,特別適用於資料中心、光纖網路、AI 運算與消費性電子中的光通訊與高速資料傳輸互連應用。
我們採用先進的半導體製程技術,確保元件具備高均勻性、優異的耦合效率與低串擾特性。該系列元件已通過嚴格的可靠度與耐久性測試,確保在各種環境下皆能穩定運作。該光元件除了整合於自有的光電模組中,該產品也已通過多家國內外客戶驗證,並導入其新一代產品設計中。隨著對高速光學解決方案的需求日益增加,我們將持續以創新、品質與市場領導為核心,不斷推動技術進步與產品優化。

VCSEL

(Vertical Cavity Surface Emitting Laser)

MM 980nm 25Gbps

(Top Emission)

QV-M0980025-Txx-E0 is multimode 25Gbps VCSEL with wavelength 980nm device has low electrical parasitics and proven high reliability. That has top side ohmic contacts with Signal-Ground (SG) configurations. The device is available in singlet (1×1) or array configurations (1×4) and are compatible with wire-bonding and flip-chip bonding.

MM 980nm 25Gbps

(Bottom Emission)

QV-M0980025-Bxx-E0 is multimode 25Gbps VCSEL with wavelength 980nm device has low electrical parasitics and proven high reliability. That has bottom side ohmic contacts with Signal-Ground (SG) configurations. The device is available in singlet (1×1) or array configurations (1×4) and are compatible with wire-bonding and flip-chip bonding.

PD

(Photodiode)

MM 980nm 25Gbps

(Top Illumination)

QP-M0980025-Txx-E0 is a front-side illuminated InGaAs PIN photodiode chip has a 40µm detection window and excellent performances, like low capacitance, high responsivity, low dark current, and reliability in field. The device is available in singlet (1×1) or array configurations (1×4) and are compatible with wire-bonding and flip-chip bonding.

MM 980nm 25Gbps

(Bottom Illumination)

QP-M0980025-Bxx-E0 is a bottom-side illuminated InGaAs PIN photodiode chip has 50µm detection window and excellent performances, like low capacitance, high responsivity, low dark current, and reliability in field. The device is available in singlet (1×1) or array configurations (1×4) and are compatible with wire-bonding and flip-chip bonding.

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