特崴光波導目前已成功開發並驗證光學元件 「MM 980nm 25Gbps VCSEL & PD」，該產品採用多模（MM）設計，可同時滿足 COB（Chip on Board）及 Flip-Chip 封裝製程 的需求，提供高效能、高可靠性的光學解決方案。憑藉其穩定的光學特性、低功耗及高頻寬傳輸能力，此系列產品特別適用於次世代光通訊、高速數據傳輸及光互連應用，涵蓋資料中心、高速光纖網路、AI運算及消費性電子產品等領域。
在技術研發與品質控管方面，特崴光波導採用先進的半導體製程技術，確保產品具備高均勻性、高耦合效率及低串擾特性，進一步提升光學訊號的傳輸品質。此外，該產品已通過嚴格的可靠性測試與環境壽命驗證，確保其在各種應用場景下均能保持穩定的效能表現。
除了廣泛應用於特崴光波導的自製光電模組外，該產品亦已獲得國內外多家客戶的驗證與採用，並成功導入至多款新產品設計中。隨著市場對高速光通訊技術需求的不斷提升，特崴光波導將持續投入技術創新，致力於提供高品質、高效能的光學解決方案，以滿足多元化應用需求，進一步提升市場競爭力。
VCSEL
(Vertical Cavity Surface Emitting Laser)
MM 980nm 25Gbps
(Top Emission)
QV-M0980025-Txx-E0 is multimode 25Gbps VCSEL with wavelength 980nm device has low electrical parasitics and proven high reliability. That has top side ohmic contacts with Signal-Ground (SG) configurations. The device is available in singlet (1×1) or array configurations (1×4) and are compatible with wire-bonding and flip-chip bonding.
MM 980nm 25Gbps
(Bottom Emission)
QV-M0980025-Bxx-E0 is multimode 25Gbps VCSEL with wavelength 980nm device has low electrical parasitics and proven high reliability. That has bottom side ohmic contacts with Signal-Ground (SG) configurations. The device is available in singlet (1×1) or array configurations (1×4) and are compatible with wire-bonding and flip-chip bonding.
PD
(Photodiode)
MM 980nm 25Gbps
(Top Illumination)
QP-M0980025-Txx-E0 is a front-side illuminated InGaAs PIN photodiode chip has a 40µm detection window and excellent performances, like low capacitance, high responsivity, low dark current, and reliability in field. The device is available in singlet (1×1) or array configurations (1×4) and are compatible with wire-bonding and flip-chip bonding.
MM 980nm 25Gbps
(Bottom Illumination)
