QuantumZ has successfully developed and validated the “MM 980nm 25Gbps VCSEL & PD” optical components. Designed with a multi-mode (MM) architecture, they support both COB and Flip-Chip packaging, offering high performance, reliability, and broad compatibility. With stable optical characteristics, low power consumption, and high-speed data transmission, they are ideal for optical communication, high-speed data transfer, and interconnect applications across data centers, fiber networks, AI computing, and consumer electronics.
QuantumZ employs advanced semiconductor fabrication to ensure high uniformity, excellent coupling efficiency, and low crosstalk. These components have undergone rigorous reliability and durability testing, guaranteeing stable operation in diverse environments.
Beyond integration into QuantumZ’s optoelectronic modules, these products have been validated by domestic and international customers and are being adopted into new product designs. As demand for high-speed optical solutions grows, QuantumZ remains committed to innovation, quality, and market leadership.
VCSEL
(Vertical Cavity Surface Emitting Laser)
MM 980nm 25Gbps
(Top Emission)
QV-M0980025-Txx-E0 is multimode 25Gbps VCSEL with wavelength 980nm device has low electrical parasitics and proven high reliability. That has top side ohmic contacts with Signal-Ground (SG) configurations. The device is available in singlet (1×1) or array configurations (1×4) and are compatible with wire-bonding and flip-chip bonding.
MM 980nm 25Gbps
(Bottom Emission)
QV-M0980025-Bxx-E0 is multimode 25Gbps VCSEL with wavelength 980nm device has low electrical parasitics and proven high reliability. That has bottom side ohmic contacts with Signal-Ground (SG) configurations. The device is available in singlet (1×1) or array configurations (1×4) and are compatible with wire-bonding and flip-chip bonding.
PD
(Photodiode)
MM 980nm 25Gbps
(Top Illumination)
QP-M0980025-Txx-E0 is a front-side illuminated InGaAs PIN photodiode chip has a 40µm detection window and excellent performances, like low capacitance, high responsivity, low dark current, and reliability in field. The device is available in singlet (1×1) or array configurations (1×4) and are compatible with wire-bonding and flip-chip bonding.
MM 980nm 25Gbps
(Bottom Illumination)